Electronics Manufacturing Glossary

The electronics industry is packed with acronyms and terms that may be confusing to the uninitiated. However, it is imperative that we fully understand all terms used, whether you are an engineer or in any other role. By understanding the common terminology used in PCB manufacturing, we can ensure we work together to present you with a final product that perfectly meets your expectations.

A

B

C

D

E

F

G

H

I

J

K

L

M

N

O

P

Q

R

S

T

U

V

W

X

Y

Z


A

AOI (Automated Optical Inspection)

A testing and quality control process that scans the circuit board with a camera to find damaged or incorrectly installed electronic components that could otherwise lead to catastrophic failure of the board.

B

BGA (Ball-Grid Array)

A type of surface-mount packaging for circuit boards that uses balls rather than pins to mount the component on the board. This style of design allows for a higher density of components to be used on the circuit board.

BOM (Bill of Materials)

A complete list of the raw materials, components, connections, and quantities used in the manufacturing project.

C

Component

Individual parts of an electronic circuit. Each component will perform a different function (such as capacitors storing charge). Components are arranged and mounted on circuit boards.

D

DFM (Design for Manufacturing)

The process of designing products for easy manufacturing, with the ultimate end goal of creating a good product at a low cost.

DFT (Design for Testability)

The process of designing products with a methodology from the start to minimise issues and support fault detection during the manufacturing process. This can reduce costs, ensure reliability, and bring efficiency to the testing stage.

E

ESD (Electrostatic Discharge)

The sudden release of stored electrical charge. A common example is a static shock. While most static shocks are harmless, in the electronic manufacturing industry, too high a voltage during ESD can result in damaged components, thus requiring robust safety protocols on a manufacturing floor and at testing.

EMS (Electronic Manufacturing Services)

A service that takes a design or idea and manufactures the final product. J-TEQ is an EMS combining technical expertise, specialised equipment, and end-to-end production capabilities.

F

Functional Test

The electrical testing of a circuit board or electronic device in a simulation of the intended function of said device.

G

Gerber File

The industry standard file type for PCB designs.

H

Hand Soldering

The process of mounting and fixing electronic components to a PCB by hand.

I

IC (Integrated Circuit)

The combination of electronic components on a semiconductor material, such as silicon. Also known as microchips, integrated circuits allow for complex circuit designs in compact spaces.

ICT (In-Circuit Testing)

The testing of an isolated part of an electronic circuit rather than the whole system.

IPC Standards

Set forth by the Institute for Printed Circuits, IPC Standards standardise safety and practices across the electronics industry with the end goal of creating better products and safer manufacturing environments.

ISO 9001

A Quality Management Systems standard from the International Organization for Standardization. While applicable to many industries beyond the electronics sector, ISO 9001 provides a standard for quality products and service and requires companies to provide a certain level of customer service and drive for improvement.

ISO 13485

A Quality Management Systems standard from the International Organization for Standardization, specifically regarding the design, development, production, and servicing of devices in the medical industry. ISO 13485 is developed from the frameworks drawn by ISO 9001 and places emphasis on patient safety and risk management throughout the lifecycle of the product.

L

LGA (Land Grid Array)

A type of surface-mount packaging for circuit boards that uses pads to mount the component on the board. Results in reliable connections and high performance of electronic components.

N

NPI (New Product Introduction)

The structured introduction and testing that brings a product idea through manufacturing and makes it ready for mass production. Since PCB design and refinement can take a lot of time and resources, a good NPI strategy is needed for maximum efficiency.

O

OEM (Original Equipment Manufacturer)

A company that sells components and products used and assembled by other companies.

P

Pad

The exposed copper of a printed circuit board, where components are soldered onto to create connections and physical support for the board design.

PCB (Printed Circuit Board)

A PCB is a board (often green in colour) where electronic components are mounted, allowing them to work together in a circuit for a specific function. PCBs act as the "brain" or "nervous system" of our electronic devices.

PCBA (Printed Circuit Board Assembly)

The creation and manufacturing process of a PCB, involving the placement and attachment of components on circuit boards.

Pick-and-Place Machine

A machine used for the quick and accurate placement of components on PCBs.

Prototype

An early creation of a PCB, allowing for functional testing and refinement to perfect the device before it is sent to mass production.

Q

QFP (Quad Flat Package)

A surface-mount electronic component with pins on all sides. Most suited for systems that require a high level of space efficiency and compactness.

QFN (Quad Flat No-Lead)

A surface-mount electronic component with pins placed on the bottom of the device rather than around the sides. Most suited for systems that require a high level of space efficiency and compactness.

QMS (Quality Management Systems)

A formalised and regulated framework that sets out processes and compliance expectations, used by companies to meet customer and regulatory expectations and drive improvement.

R

Reflow Soldering

The standard industry method for attaching components to circuit boards. Solder paste is applied to hold components in place, and then the device is placed in a reflow oven to melt the solder and permanently affix the components to the circuit board.

RoHS (Restriction of Hazardous Substances)

A directive from the European Union to reduce the use of dangerous chemicals such as lead, mercury, and cadmium in electrical and electronic equipment, making it easier to recycle.

S

Selective Soldering

An automated process used for the soldering of individual through-hole components, allowing for precise, consistent, and efficient application without compromising nearby SMT components.

Silkscreen

The ink layer on top of the green circuit board, showing where the components should be mounted, what they are, and where the PCB's test points are located, in addition to other important safety information.

SMT (Surface Mount Technology)

Surface Mount Technology (SMT) is a process for circuit board manufacture where components are mounted directly onto the board rather than attached through drilled holes.

Solder Paste

A mixture of solder alloy and flux, the "glue" used to attach components to circuit boards before reflow.

Stencil

A stainless steel, laser-cut stencil used to control the placement and amount of solder paste used on a circuit board during component mounting.

T

Through-Hole

A drilled hole in a circuit board that passes through every layer.

Tombstoning

A defect caused by the tilting of a component on the circuit board, resulting in solder only being applied correctly on one side of the component.

V

Via

A drilled hole in a circuit board that allows charge to move between the layers. The hole may only extend through a few layers, or it may be a through-hole, extending from one side to the other.

W

Wave Soldering

A bulk soldering process used in the mass production of PCBs, where a standing wave of solder passes over the circuit boards.

X

X-Ray Inspection

An inspection method used to observe faults and defects in circuit board components that might not be visible to the eye.

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