Surface Mount Technology PCB Assembly

Integrated surface mount technology (SMT) solutions for all your electronic assembly needs.

What Is Surface Mount Technology?

Surface mount technology (SMT) is an assembly process of printed circuit boards (PCB) in which electronic components are soldered directly onto the board's surface rather than inserted through drilled holes.

SMT assembly is the most widely used process in modern PCB design and assembly.

Our SMT PCB Assembly Process

At J-TEQ, we use state-of-the-art equipment to deliver adaptable and flexible services, especially in SMT manufacturing. Our ability to place 0201 components is a key advantage in modern PCB assembly, which provides the precision needed for high-performance electronic products.

With 3 SMT lines, our class-leading machinery can cater to a variety of production demands, from prototypes and low-batch production runs for process validation to high-volume manufacturing when scaling up.

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Our SMT Placement Capabilities

Delivered with exceptional accuracy and reliability, our SMT placement capabilities are designed to meet even the most demanding precision assembly requirements. We support a wide range of component sizes and types, including:

Ultra Ball Grid Array (uGBA), also known as Micro Ball Grid Array (µBGA)

Ball Grid Array (BGA)

Fine-Pitch Quad Flat Packages (QFPs)

Your Trusted Partner for Surface Mount Assembly

At J-TEQ, our focus on flexibility, quality, and scalability sets us apart as a trusted partner for companies looking to outsource PCBA, electromechanical integration, and system-level assembly.

With a commitment to delivering high-quality solutions, J-TEQ ensures that every project, regardless of complexity or volume, exceeds customer expectations and meets the highest industry standards.

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