Through-hole technology is an assembly process of printed circuit boards (PCB) in which component leads are inserted into plated through-holes (vias) and soldered to pads on the opposite side, creating a robust pin-to-pad metallurgical bond.
Through hole assembly is favoured for high mechanical strength, power handling, and reliability under thermal or vibration stress, typical in aerospace, defence, and industrial applications.
We provide dual capabilities in both RoHS and Non-RoHS processes, allowing us to meet various regulatory requirements, including the EU's Restriction of Hazardous Substances directive.
This flexibility is particularly beneficial for customers who need assemblies with both leaded and lead-free components.
At J-TEQ, we offer a full suite of through hole assembly, delivered in a dedicated hand insertion area run by highly skilled operators.
We deploy hand soldering, wave soldering, selective soldering – or a combination of techniques – to ensure the highest quality results.
Whether you need a handful of boards for proof-of-concept or tens of thousands for a mature product, our processes scale seamlessly. You get rapid prototyping, smooth ramp-up, and dependable high-volume output from a single, trusted partner.
